Plasma enhanced chemical vapor deposition of p-type Cu<sub>2</sub>O from metal organic precursors

نویسندگان

چکیده

The scope of this work was to optimize the reactant delivery parameters for plasma enhanced chemical vapor deposition (PECVD) p-type Cu2O films from Cu(hfac)(tmvs), with aim explore an alternative other large-area techniques such as sputtering. While n-type metal oxide semiconductors amorphous indium gallium zinc have now been developed and offer significantly improved device performance over hydrogenated silicon, devices achieving mobilities &amp;gt;10cm2(Vs)−1, there is still absence good inorganic that provide similar performance. a promising oxide, but remain limitations on industrial scalability some processes demonstrated so far. PECVD has scaled uniform generation 10 display glass (2.88×3.13m2) provides viable alternative. deposited in achieved Hall mobility ∼1cm2(Vs)−1 were stable period months. Contrary previous reports “incubation” period, initial growth rate during immediately following nucleation (∼40 nm/pulse) times greater than steady state (∼4 later deposition. Topographical scaling methods fractal analysis film surface morphology using atomic force microscopy, at different stages development, link shift regime transition dominated by diffusion volume diffusion.

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ژورنال

عنوان ژورنال: Journal of Applied Physics

سال: 2022

ISSN: ['1089-7550', '0021-8979', '1520-8850']

DOI: https://doi.org/10.1063/5.0089757